| Items | Capabilities | More information |
| Capacity | 25000㎡/Month |
|
| Product types | Rigid,Flex,Rigid-flex | Metal base(AL, Copper, Iron), Ceramics base, HDI, Mix material, Blind holes, Buried holes |
| Material types | Shengyi, KB, ITEQ, ILM, Rogers, GONTCERA | Halogen free, high frequency |
| Copper thickness | H OZ to 10 OZ |
|
| Layers | 1~32L rigid,1~4L flex |
|
| Board thickness | 0.1mm-6.4mm |
|
| Max product size | 1500mm*600mm |
|
| Min product size | 10mm*10mm |
|
| Min hole size | 0.1mm | 0.15mm via holes |
| Hole size tolerance | PTH: +/-0.075mm; NPTH: +/-0.05mm |
|
| Hole copper thickness | 20-30um |
|
| Width&space | 0.075mm |
|
| Min.open pad | 0.15mm*0.15mm |
|
| Min component remark words | 0.15mm |
|
| Hole position deviation | ±0.05mm |
|
| v-cut Registration accuracy | ±0.1mm |
|
| V-cut material thickness range | 0.3mm-3.2mm |
|
| Outline tolerance | ±0.1mm | +/-0.05mm by laser or mold |
| Heterotypic hole | Countersunk,Cup hole,Tapping 2.0mm-6.0mm |
|
| Bowl&Twist | ≤0.75% | ≤0.5% |
| Surface finishing | HASL,LF HASL,Immersion Tin, ENIG,OSP,Immersion silver,Flash Gold | ENEPIG,Carbon ink,Peelable mask |
| Ratio | 8:1 | 10:1 or 12:1 |
| Standard | IPC Class 2; IPC Class 3 |
|
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