Material:  | FR4 TG150  | Layer:  | 6L  | 
Board thickness:  | 1.6mm  | Min Hole:  | 0.15mm  | 
Copper thickness:  | 1 OZ  | Solder mask:  | Blue  | 
Min Width & Space:  | 0.2mm/0.2mm  | Silkscreen:  | White  | 
Finishing:  | ENIG 2u"  | Application:  | 5G communication devices  | 
Special:  | HDI, Half-hole, impedance control, resin plugged  | ||
          

			
		
 
 
 
 
 




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