Material: | FR4 TG150 | Layer: | 6L |
Board thickness: | 1.6mm | Min Hole: | 0.15mm |
Copper thickness: | 1 OZ | Solder mask: | Blue |
Min Width & Space: | 0.2mm/0.2mm | Silkscreen: | White |
Finishing: | ENIG 2u" | Application: | 5G communication devices |
Special: | HDI, Half-hole, impedance control, resin plugged |